| 摘要 |
PURPOSE:To eliminate a warp which tends to generate easily in a package when one surface is sealed by transfer-forming only the surface where an IC is mounted of a printed circuit board using a thermally curable resin at lower than a glass transition temperature. CONSTITUTION:An IC 3 is bonded using a die, on a printed circuit board 1, then a circuit formed on the printed circuit board 1 is connected to a wire bond. Next, an epoxy resin is transfer-formed as a sealing resin 4 on only the surface where an IC is mounted, at lower than a glass transition temperature of the sealing resin 4 to form a thin plastic IC package. If the mentioned process is employed, a thin plastic IC package where a warp which tends to generate easily during a one surface sealing process, hardly occurs, can be obtained without drastically changing equipment and devices used for manufacturing plastic packages such as TSOP. |
