发明名称 |
METHOD FOR SINGLE WAFER PROCESSING IN WHICH A SEMICONDUCTOR WAFER IS CONTACTED WITH A FLUID |
摘要 |
A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.
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申请公布号 |
US5230743(A) |
申请公布日期 |
1993.07.27 |
申请号 |
US19920922197 |
申请日期 |
1992.07.30 |
申请人 |
SEMITOOL, INC. |
发明人 |
THOMPSON, RAYMON F.;GORDON, ROBERT W.;DURADO, DANIEL |
分类号 |
H01L21/00;H01L21/687 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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