| 摘要 |
PURPOSE:To provide an electronic component which can avoid circuit failure caused by heat by effectively dissipating the heat generated by a semiconductor chip. CONSTITUTION:An electronic component C is constituted of a substrate 1, a semiconductor chip P mounted on the substrate, a lead 10a externally extending from the substrate, a mold body 3, which is formed at the junction of the substrate and the lead 10a and that connects the lead 10a with the substrate, a first heat dissipating means 21 mounted on the external plane of the semiconductor chip P and a second heat dissipating means 22 mounted on the external plane of the substrate. |
