| 摘要 |
<p>PURPOSE:To enable the number of input/output points to be increased by allowing a pad placement region for input and a pad placement region for output in correspondence with a cell for input and a cell for output. CONSTITUTION:A pad 2 for input is connected to a cell 6 for input and a pad 4 for output is connected to a cell 8 for output. For example, when mutually different lead terminals 24 of a package constituting a semiconductor device are used for signal input and signal output respectively, the wired pad 2 for input and the lead terminal 24 for signal input are connected by a bonding wire 28 and at the same time the pad 4 for output and the lead terminal 24 for signal output are connected in a similar manner, thus enabling both of the cells to be utilized and the number of input/output to be increased without wasting either of the cell for input or cell for output within the cell for input/ output of each pair.</p> |
