| 摘要 |
<p>PURPOSE:To simultaneously connect a plurality of semiconductor chips on a semiconductor wafer with external circuits so that the chips can be simultaneously tested for electrical characteristics. CONSTITUTION:The title circuit has such a feature that bonding pads P1-Pk (or Pk+1-Pn) on facing sides of each semiconductor chip are electrically connected to each other in each circuit. In other words, the bonding pads P1-Pk (or Pk+1-Pn to or from which the same signals are inputted or outputted are respectively provided on the facing sides. As a result, when probe needles 22 are pressed against the pads on either one of the facing sides, each chip can be tested for electrical characteristics. Therefore, when the needles 22 are arranged around a plurality of semiconductor chips 20, the chips 20 can be simultaneously connected to IC testers.</p> |
