| 摘要 |
PURPOSE:To achieve connection efficiently at the minimum plating area and to prevent the short circuit between a lead and a semiconductor edge by coating the surface with an insulator, using the lead, wherein only the tip surface is exposed to a conductor, and directly bringing the lead into contact with an electrode, when plating junction is performed. CONSTITUTION:The entire surface of a lead part 1 is coated 2 with insulating paint, film, insulating inorganic material or the like. Then, a tip part 3 of the lead 1 is cut, and the conductor of the lead 1 is exposed to a cut edge 4. The coating 2 at the tip part 3 of the cut lead 1 is removed with solvent and the like, or the lead 1 is exposed without applying coating on the tip part 3. The lead part 1 is arranged at the position of an electrode 6, which is provided on the surface of a semiconductor element 5, brought close to or into contact with the surface of the electrode 6 and fixed with a jig. The lead part is submerged into plating bath or placed in spray plating liquid. The exposed conductor of the lead edge 4 and the surface of the electrode are connected to the plating metal 7. |
