发明名称 MULTILAYER PRINTED WIRING BOARD FOR LARGECURRENT USE
摘要 <p>PURPOSE:To use a conductive layer at an intermediate layer as a conductive layer for large-current use in the same manner as a conductive layer at the outside, to increase the degree of freedom in the designing operation of a large- current circuit and to easily form the circuit in a multilayer printed wiring board for large-current use. CONSTITUTION:Large holes 11a, 11b are made in a printed wiring board on the upper side in such a way that intermediate conductive layers 2a sandwiched between insulating boards 1 are exposed so as to obtain contact areas which are respectively suitable for transmitting a large electric current. A large-current element 8 is attached by means of bolts 4A to 4C made of a conductive material and other clamping utensils which come into face contact with the exposed conductive layers 2a. A heat resistance and a conductor resistance are made small by the large contact areas of the intermediate conductive layers with the clamping utensils. Thereby, the large electric current can be supplied to the intermediate conductive layers.</p>
申请公布号 JPH05175665(A) 申请公布日期 1993.07.13
申请号 JP19910357851 申请日期 1991.12.25
申请人 OKUMA MACH WORKS LTD 发明人 IKEGAMI MITSURU;ADACHI MITSUAKI
分类号 H05K3/46;H05K7/20 主分类号 H05K3/46
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