| 摘要 |
There is disclosed a high density test probe assembly, and method of fabricating it. The probe assembly has a multitude of wire-like probe elements whose exposed tips are spaced on centers X and Y to match the centers of closely spaced surface pads of a VLSI circuit. Interconnections to and from the probe elements (for connection to external test equipment) are provided by a multi-layer arrangement of insulating and conducting layers within the body of the probe assembly. The tips of the probe elements are canted relative to vertical so that when the probe assembly is pushed down into mating position onto a VLSI circuit, the probe elements uniformly deflect laterally in one direction only and give a "wiping" action in contacting surface pads of the VLSI circuit together with a desired normal contact force. The method of fabricating the probe assembly includes forcing all of the probe elements through staggered vias in the multilayer arrangement. This step simultaneously makes desired electrical interconnections to the probe elements, precisely aligns and captivates the probe elements, and bends (cants) their ends so that they deflect uniformly in one direction only when the probe assembly is mated with a VLSI circuit.
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