| 摘要 |
<p>PURPOSE:To enable a printed wiring to be protected against disconnection at an environmental test or the like by a method wherein a nickel plating layer and a gold plating layer which cove a copper wiring and a resist layer which covers a record surface are provided. CONSTITUTION:A semiconductor device is equipped with a printed wiring board 3 which includes a first surface section composed of semiconductor mounting 1 and a wire bonding section 2, a second surface section of the rest, and a copper wiring section 4 laid or the second surface section. Especially, a nickel plating layer 6 and a gold plating layer 7 covering the copper wiring section 4 and a solder resist 5 which covers the second surface section are provided. A sealing frame 10 used for sealing up the upside of the printed wiring board 3 is arranged on the nickel plating layer 6 and the gold plating layer 7. By this setup, the disconnection of the copper wiring 4 caused by a thermal expansion coefficient difference between sealing resin 9 and the printed wiring board 3 can be prevented, and an environmental test can be enhanced in reliability.</p> |
