| 摘要 |
PURPOSE:To mount the title LSIs in a compact manner by a method wherein a plurality of optical fibers are installed in such a way that their ends are situated on the surface and the rear surface of a package and that the fibers are installed perpendicularly to the package. CONSTITUTION:An LSI bare chip 1 which communicates a piece of information with the outside by means of an optical signal is housed inside a package 2. A plurality of optical fibers 3 which occupy a determined position on the right- side part of the package 2 in such a way that their ends are situated on the surface and the rear surface of the package 2 and that the fibers are perpendicular to the package 2. A plurality of LSI's which have been constituted in this manner are mounted in such a way that they are stacked at the upper part and the lower part of a printed wiring board. At this time, the individual LSI's form routes of optical signals by the longitudinal connection of the plurality of optical fibers 3, and a piece of information between the individual LSIs is transmitted by using one of the plurality of optical-signal routes (optical fibers 3). |
