发明名称 MULTILAYER WIRING BOARD
摘要 <p>PURPOSE:To enable a signal transmission line to be set uniform in characteristic impedance and prevent delay and malfunction caused by the reflection of signal. CONSTITUTION:Recessed holes 126 and 127 whose ends are open on the rear side are made just under a terminal connection pad 121 and a surface wiring layer 122 located on the component mounting surface of a multilayer wiring board. Holes 128 and 129 are made between the base of the recessed hole 126 or 127 and the terminal connection pad 121 or the surface wiring layer 122 respectively, and rigid coaxial cables 130 and 140 and their conductors 131 ands 141 are inserted into the recessed holes 126 and 127 and the holes 128 and 129 respectively. Furthermore, the conductors 131 and 141 are connected to the terminal connection pad 121 and the surface wiring layer 122 respectively. In a multilayer wiring board 120 constituted as above, signals are inputted into the terminal 111 of an LSI 110 through the terminal connection pad 121 or transmitted to the surface wiring layer 122 through the intermediary of the conductors 131 and 141 of the rigid coaxial cables 130 and 140.</p>
申请公布号 JPH05167258(A) 申请公布日期 1993.07.02
申请号 JP19910328711 申请日期 1991.12.12
申请人 NEC CORP 发明人 FUKUMA YASUAKI
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
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