| 摘要 |
PURPOSE:To provide an optical integrated circuit which is reduced in thickness, size and weight, improved in mass productivity and adequate for optical information processors, such as optical pickups and laser printers. CONSTITUTION:Electronic parts, such as photodetector 42 for monitoring a laser light output, multidivided photodetectors 44, etc., are assembled to a photoelectron integrated substrate 40 consisting of a silicon substrate by using the process for production of the existing integrated circuits. A semiconductor laser element 41 mounted to a sub-mount 43 is packaged to the photoelectron integrated substrate 40. On the other hand, a diffraction grating 32 for forming three beams, a hologram beam splitter 33, a hologram collimating lens 34 and an aspherical objective lens 35 are integrally formed by a molding method including an inscribing technique on both upper and back surfaces of the transparent substrate. Such photoelectron integrated substrate 40 and the transparent substrate 30 are stuck to each other by using an adhesive consisting of a UV curing resin or thermoplastic resin, by which the optical integrated circuit 1 is produced. |
