| 摘要 |
An improved, extended lifetime collimator for cathode sputtering has a plurality of passages which taper longitudinally from a target side of the collimator to a wafer side of the collimator. This longitudinal tapering reduces the adverse effects on collimator useful life and wafer deposition rate which are generally caused by the accumulation of sputtered particles on exposed surfaces on the target side of the collimator. Compared to prior collimators, this collimator may be used to sputter coat a greater number of wafers before replacement or cleaning is necessary, thereby enhancing throughput capability.
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