发明名称 CHIP ELECTRONIC COMPONENT SUPPLYING DEVICE
摘要 PURPOSE:To improve a tape feeding accuracy at the time of supplying a chip electronic component, to reduce a component suction mistake and to facilitate available operability. CONSTITUTION:A tape pressing mechanism 15 of a downstream side so presses from an upper surface side of a tape in combination of a tape pressing plate 15a and a plate spring 15b as to form a structure in which a carrier tape 24 is pressed at an upper part of tape feeding sprockets 28A by a spring force to eliminate a gap between a bottom of the tape and a tooth bottom of the sprocket in such a manner that a pressing force of the spring 15b is applied from a contact point of an upper end of a mounting post 13 of the plate 15a. The spring 15b is mounted fixedly at the end of the plate 15a.
申请公布号 JPH05160598(A) 申请公布日期 1993.06.25
申请号 JP19910319130 申请日期 1991.12.03
申请人 HITACHI LTD 发明人 HAEDA YOSHIO;HONMA KAZUO;SAKAI AKIHIKO;FUJISHIRO KEISUKE;HIRAMOTO SOTOJI;NAKAMURA MITSUO
分类号 B65H18/12;B65H41/00;H05K13/02 主分类号 B65H18/12
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