| 摘要 |
PURPOSE:To accurately control the thickness of an insulating layer formed on a conducting pattern of an insulative board, while a printed circuit board is being manufactured. CONSTITUTION:An insulating layer 3 is formed on a conducting pattern 2 of an insulative substrate 1. At the same time as the forming of the insulating film 3, an insulating layer 11 for check use is formed on an unnecessary part of the insulative substrate 1 such as a redundant substrate part and a margin part. The form of the insulating layer 11 for check use is stepwise, and changed according to the number of times of formation of the insulating layer 3. Immediately after the insulating layer 3 is formed, the form of the insulating layer 11 for check use is inspected, and the number of times of formation of the insulating layer 3 is known, thereby controlling the thickness of the insulating layer 3. |
