| 摘要 |
PURPOSE:To realize downsizing, suppression of adverse effect of dust on a sample (inspection object), and enhancement of inspection accuracy. CONSTITUTION:A bonding wire inspecting apparatus inspects a pad of a semiconductor chip 1 and a wire 5 bonded to a lead 4 of a lead frame 3, and comprises an objective lens group 24 for talking in an image of a sample 6, focusing lens groups 40, 42 for focusing an image taken in by the group 24, and cameras 41, 44 for imaging the image focused by the groups 40, 42 in an optical head 23 to drive the group 24 by a Z-drive motor 29 in a Z direction. |
