| 摘要 |
PURPOSE:To raise the heat radiation efficiency from a semiconductor chip without adding external shock directly to the chip joined to a heat sink by bringing the rear of the semiconductor chip into contact with the heat radiating metal of the heat sink, and fixing it with heat conductive curing resin. CONSTITUTION:An upper 2 is laid and fixed on a lower board 1, and a cap 3 is overlaid to house the upper board 2. A semiconductor chip 5 is mounted on the upper board 2, and in the cap 3, a hole 4 is made in the position corresponding to the mounting position of the semiconductor chip 5. A bottomless conical resin retaining ring 4 is provided from the inner periphery of this hole 4a to the rear of the semiconductor chip 5, and further a metal 7 for heat radiation, which connects the rear of the semiconductor chip 5 with a heat sink 9, is installed on the semiconductor chip 5. A metal 6 for heat conduction is provided around this metal 7 for heat radiation, and the metal 7 for heat radiation is fixed onto the semiconductor chip 5. |
