| 摘要 |
PURPOSE:To improve the resistance to stress laid by solder of a semiconductor package greatly by adding specified epoxy resin, naphthol resin curing agent, inorganic filler and curing accelerator. CONSTITUTION:Biphenyl epoxy resin whose structure is expressed by formula I is added as epoxy resin by 50 to 100wt.% to the total amount of the epoxy resin composition. In the formula I, R1 to R8 are chosen from hydrogen, halogen and alkyl group. Paraxylene denaturated naphthol resin curing agent which is expressed by formula II is added as curing agent by 30 to 100wt.% to the total amount of the curing agent. In the formula II, (n) denotes 1 to 6. Inorganic filler and curing accelerator are essential components. Thereby, it is possible to realize low thermal expansion and low water absorption and to realize good resistance to stress laid by solder. |
