发明名称 CERAMIC WIRING BOARD
摘要 <p>PURPOSE:To obtain a ceramic wiring board mounting a semiconductor element which board can normally operate the semiconductor element for a long term, by reducing the change of a resistance value of a resistor, and restraining waveform perturbation to the minimum which is caused by reflection of a signal travelling a metallized wiring layer. CONSTITUTION:In a ceramic wiring board wherein metallized wiring layers 5a, 5b, 5c and a resistor 8 are formed on an insulative substratum 1, the resistor 8 is formed of 100 pts.wt. of metal powder and 10-100 pts.wt. of insulator powder. The metal powder contains 10-70wt.% molybdenum powder and 30-90wt.% rhenium powder.</p>
申请公布号 JPH05160537(A) 申请公布日期 1993.06.25
申请号 JP19910324298 申请日期 1991.12.09
申请人 KYOCERA CORP 发明人 SHIMIZU NORIMASA;TERAO SHINYA
分类号 H01L23/15;H01L25/00;H05K1/16 主分类号 H01L23/15
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