| 摘要 |
A method and apparatus for spring mounting of multi-layered electronic assemblies including a top cover (12); a bottom cover (14); first, second and third mounting supports (32); a printed wiring board (28) in contact with and supported by the first, second and third mounting supports (32) at first, second and third mounting locations, respectively; springs (30) for clamping the multi-layered electronic assembly (10) between the top cover (12) and the bottom cover (14); a load plate (24) for supporting the assembly, the load plate (24) including fourth (26), fifth (26) and sixth (27) mounting supports aligning with the first, second and third mounting locations, respectively, and in contact with the springs (30); and the top cover (12) contacting the load plate (24) and coupled to the bottom cover (14), wherein the coupling of the top cover (12) and bottom cover (14) compresses the springs (30) and securely clamps the multi-layered electronic assembly (10) within the top (12) and bottom (14) covers. <IMAGE> |
