| 摘要 |
A socket for an electrical part has a socket body to which an IC package as an electrical part is accommodated, the socket body being provided with a number of contact pins which are contacted to or separated from solder balls as terminals of the electrical part, a movable member arranged to be movable with respect to the socket body, and lever members mounted to both sides of the socket body to be rotatable. In this structure, when the lever members are rotated, the movable member is moved to displace the contact pins so as to be contacted to or separated from the solder balls of the electrical part, respectively. In such structure, each of the lever members are formed with pressing portion which acts to press a portion of the movable member in accordance with the rotation of the lever members and when the movable member is moved so as to approach a lowermost position thereof by the rotation of the lever member, the pressing portion and the pressed portion achieves surface-to-surface contact to each other.
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