| 摘要 |
A retrograde profile is formed in a photoresist layer (11, 20) by modifying the rate at which a photoresist developer solution dissolves a portion (12) of a photoresist layer (11, 20). The photoresist layer (11, 20) is exposed to a chemical such as hexamethyldisilizane or dimethylsulfoxane to allow a portion (12) of the photoresist (11, 20) to absorb the chemical. The photoresist (11, 20) is then heated in order to enhance a reaction between the photoresist (11, 20) and the chemical. The reaction modifies a portion (12) of the photoresist (11, 20) to reduce the rate at which the portion (12) of the photoresist (11, 20) is dissolved by a developer solution.
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