发明名称 CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 Disclosed is a circuit device wherein a plurality of circuit elements including a circuit element having a hollow space inside are sealed with a resin. Also disclosed is a method for manufacturing such a circuit device. A circuit device (10) comprises a first circuit element (13A) having a hollow space inside and a plurality of second circuit elements (13B) electrically connected with the first circuit element (13A). The first circuit element (13A) and the second circuit elements (13B) are sealed with a sealing resin (15). The distances between the first circuit element (13A) and each second circuit element (13B) are longer than the distances between respective second circuit elements (13B).
申请公布号 KR20060060699(A) 申请公布日期 2006.06.05
申请号 KR20067003711 申请日期 2006.02.23
申请人 SANYO ELECTRIC CO., LTD.;KANTO SANYO SEMICONDUCTORS CO., LTD. 发明人 IMAIZUMI HIDEO;KATO TAKUJI;NAKAJIMA KENICHI;HARIGAI MASAMI;KUWATA MASACHIKA;OCHIAI ISAO;TSUBONOYA MAKOTO;SHIBUSAWA KATSUHIKO;TAKASE IWAO
分类号 H03H9/64;H01L21/56;H01L23/31;H01L23/495 主分类号 H03H9/64
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