| 摘要 |
<p>PURPOSE:To provide a thin semiconductor package adapted for a long period of stable operation of a semiconductor device. CONSTITUTION:A metallic base member 2 is attached so as to block the opening of an insulating frame 1 so that the bottom of itself may not project from the bottom of the insulating frame 1, below the insulating frame 1 where one part of a metallized wiring layer 5 is led out at the bottom, and also a metallic cap member 3 is attached to the topside of the insulating frame 1 to block the opening 1a of the insulating frame 1.</p> |
