| 摘要 |
PURPOSE:To dissolve a fault in bonding of metal pieces for facilitating a selection of solder and connections through Al or Cu wires of a specified diameter value or longer. CONSTITUTION:In a metallized substrate, on which chip components 3 are mounted and wirings through wires 4 are provided and which consists of ceramics and a metal powder uncomposed material 1 consisting of 70 to 95wt.% of Cu with the remnant of Ti, metal pieces 5 are respectively provided at the connection parts of the wires 4. These metal pieces consist of at least one kind among Cu, Ag, Fe and Au, which have a melting point higher than the metallized temperature of a metal powder composition 1 for metallizing use. The metal pieces may be laminated in at least two layers. In the manufacture of this metallized substrate, the metal pieces are used for bonding of the connection parts of the wires and when a metal composition is applied at the time of the bonding of the wires, the metal pieces are respectively attached to the connection parts of the wires and at the same time a metallized firing is performed to make the metal pieces bond to the wires. |
