SUBSTRATE OF FRONT END MODULE AND FABRICATING METHOD THEREOF

摘要

A front end module substrate and a method for manufacturing the same are provided to emit heat generated from a power amplifier to an external by inserting a ceramic substrate having a plurality of heat dissipation holes into a multi layer printed circuit board having a groove on a lower part of the power amplifier. A front end module substrate includes a multi layer printed circuit board(100), and a ceramic substrate(200) for heat dissipation. A groove having a predetermined depth is formed on a lower part of the multi layer printed circuit board. A plurality of first heat dissipation holes are formed on the groove. A first conducting material is formed on an internal wall of the first heat dissipation holes. The ceramic substrate for heat dissipation is embedded into the groove, and is contacted with the multi layer printed circuit board. A plurality of second heat dissipation holes are formed on a location corresponding to a location of the first heat dissipation holes. The second heat dissipation holes are filled with a second conducting material. A depth of the groove is 1/4-3/4 of a thickness of the multi layer printed circuit board.