| 摘要 |
PURPOSE:To reduce packaging cost of light emitting diodes, and also, enhance emission efficiency of light emitting devices. CONSTITUTION:An MCB base 10, where a chip mounting recessed part 11 is formed, is injection-molded with thermoplastics. A wiring pattern 12 and an LED bare chip 13 formed on the top of the base 10 are die-bonded substantially in the central part of the recessed par 11 by way of Ag paste or the like. An Au wire 14 which connects the LED chip 13 to the wiring pattern 12, transparent sealing resin 15 and the like are formed in the shape of a convex lens by injecting resin whose quantity exceeds the volume of the chip mounting recessed part 11. |
