MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEAD FRAME

摘要

PURPOSE:To provide a method of improving sealing up of a semiconductor chip with resin and an improved lead frame used for that method, where a die stage is prevented from being deformed when the semiconductor chip is sealed up with resin. CONSTITUTION:In a semiconductor device manufacturing method where a process through which a semiconductor chip 3 is mounted on a die stage 2 of a lead frame and sealed up with resin is provided, an under stage 3 is provided under the die stage 1, the periphery of the under stage 3 is partially fixed to the peripheral region of the die stage 1, and then the semiconductor chip 2 is sealed up with resin.