| 摘要 |
A semiconductor fabricating apparatus is provided to remove rebound defects capable of being generated in a cleaning process by including a net capable of reducing the flow rate of a cleaning solution in the edge portion of a rinse nozzle. A rinse nozzle injects a cleaning solution to the surface of a wafer. A net(140) is installed in the edge portion of the rinse nozzle. The net is made of teflon. The rinse nozzle is connected to a cleaning solution supply pipe. The cleaning solution supplied to the rinse nozzle is one selected from distilled water, ultra pure water, deionized water and a composition thereof.
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