| 摘要 |
To plate a metal substrate such as Fe, Mg or Al with a protective film of titanium, the substrate is treated in a bath comprising titanium in ionic form so as to form a deposit of the titanium on the substrate. No pre-treatment with a cyanide solution is required. In the case of Fe, deposition is carried out electrolytically; in the case of Mg or Al, deposition is carried out non-electrolytically.
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