Adhesiveless susceptor films and packaging structures

摘要

A susceptor composite and related packaging devices employing the susceptor composite comprising a plurality of heat sealable layers is disclosed. The susceptor composite is adhesiveless and is used in food packages for heating and cooking food products in a microwave oven. In one preferred embodiment, a first substrate of amorphous polyester has a metallic microwave absorptive layer deposited on one of its surfaces. A dimensionally stable layer that includes a heat sealable material is heat sealed to at least one of the first substrate and microwave absorptive layer. The heat sealable film can be applied in a pattern and can also be applied using different heat-sealing temperatures to provide selective microwave absorption to the susceptor composite of the invention.