| 摘要 |
PURPOSE:To provide the X-ray inspecting method capable of satisfactorily inspecting the soldered state of a back fillet. CONSTITUTION:X-rays are radiated to the solder fixing a lead L bent and extended outward from the molded body M of an electronic part P to a board 10, and the quality of the soldered state is inspected from its transmission image. When the board 10 is inclined, separate images of the inclination section La of the lead L and the back fillet S1 of the solder S fixing the inclination section La to the board 10 are obtained, and the quality of the soldered state is judged from the separate images. |
