PHOTOSENSITIVE ADHESIVE COMPOSITION, ADHESIVE FILM, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition suitable as a film material to be used for a method for manufacturing a semiconductor device, the composition which exhibits excellent moisture resistance and flatness with little level unevenness after polished when an adhesive layer of the composition formed on a wafer is used as a resist for forming a wiring pattern and also as an adhesive for connecting elements and which has no residue of a conductor on the adhesive layer and excellent reflow resistance, and to provide a film type adhesive, an adhesive film, an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device using the above composition.SOLUTION: The photosensitive adhesive composition is supplied as a film material 1 to be used for the following method of manufacturing a semiconductor device. The method includes the following steps in the described order: a step of forming a resin composition layer on a first semiconductor substrate; a step of partially removing the resin composition layer to form an opening for forming a connection terminal; a step of forming a conductor layer for forming a connection terminal on the opening; grinding an excessive portion of the conductor layer to separate each terminal in the opening from other terminals which have been formed as connected; and a step of connecting the first semiconductor substrate to a second semiconductor substrate.SELECTED DRAWING: Figure 6