| 摘要 |
<p>A thermal head for thermal recording or thermal transfer recording and a method of manufacturing the head. The head has a heat sink (10) having an upper surface, a heating element substrate (11), disposed on the upper surface of the heat sink, having a projected convex portion (11b) on which an array of heating resistor elements (16) are arranged, an electrical structure mounted on the same side as that of the upper surface of the heat sink means (10) and electrically connected to the heating resistor elements (16), and a protection structure for mechanically protecting the electrical structure. The substrate (11) is constituted that height of the substrate (11) from the surface of the heat sink means (10) is higher than height of the protection structure, and height of the projected convex portion (11b) is equal to or more than 0.6 mm. <IMAGE></p> |
