发明名称 Noise supression in memory device
摘要 This invention relates to an arrangement method of signal lines o1, o2, o3, o4 of a peripheral circuit of a memory array block within a chip in a semiconductor memory device wherein shield wirings S1, S2, S3 are inserted between signal lines, so that a noise transmission path caused by coupling capacitance between adjacent signal lines is cut off, and therefore, the noise generated at each signal line of the peripheral circuit of the memory array block is suppressed. Shield wiring may be installed also between first and second signal line groups. Thus, malfunction of the chip may be prevented and the reliability of the semiconductor memory device can be improved. <IMAGE>
申请公布号 GB2261991(A) 申请公布日期 1993.06.02
申请号 GB19920024770 申请日期 1992.11.26
申请人 * SAMSUNG ELECTRONICS CO LIMITED 发明人 KYUNG-HO * KIM;HONG-SUN * HWANG
分类号 H01L21/3205;G06F11/00;G11C7/02;G11C7/18;G11C8/14;H01L21/822;H01L23/52;H01L23/522;H01L23/552;H01L27/04;H01L27/10;H04B15/00 主分类号 H01L21/3205
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