SEMICONDUCTOR PACKAGE PROVIDED WITH HEAT SINK,申请号JP19910293376-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE PROVIDED WITH HEAT SINK
摘要
申请公布号	JPH05136302(A)	申请公布日期	1993.06.01
申请号	JP19910293376	申请日期	1991.11.08
申请人	NEC CORP	发明人	HOJO SAKAE
分类号	H01L23/36;H01L23/467	主分类号	H01L23/36
代理机构		代理人
主权项
地址

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