| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate capable of increasing the signal transmission quantity, by increasing the wiring density of a wiring layer for data transmission.SOLUTION: A second conductor layer 34F is embedded in a second resin insulation layer 20F, while exposing only the upper surface therefrom. A roughened layer is not provided on the side surface and upper surface of the second conductor layer 34F. The space between the second conductor layers 34F can thereby be filled with a first resin insulation layer, without leaving any bubble. Consequently, insulation reliability is hardly reduced even if the wiring density of the second conductor layer 34F is increased, and the signal transmission quantity can be increased.SELECTED DRAWING: Figure 1 |
