| 摘要 |
PURPOSE:To obtain a method of treating an inner copper foil which serves as an inner material of a multilayer copper plated laminate board, where hollowing is prevented and fine particles of base metal are not left unremoved between circuits so as not to cause a short circuit to an inner circuit. CONSTITUTION:A copper oxide film is formed on a copper circuit provided onto the surface of an inner material, base metal is attached, then the copper circuit is reduced by acid and then to an alkaline neutralization treatment, and the circuit is rinsed with water kept at a temperature of 20-90 deg.C. |
