| 摘要 |
Disclosed is a semiconductor device incorporating a plurality of photodiodes and comprising a prism on the device surface. A first and second optical film are deposited on the surface of a first photodiode. Furthermore, the first optical film is formed on the surface of a second photodiode, and the second optical film is provided at the periphery of the photodiode. This structure securely protects the pn junction of the second photodiode during manufacture. In addition, a light-shielding metal film formed at the periphery of the photodiodes has an insulation film deposited thereon, the insulation film containing very loss stress and providing high adhesiveness with respect to the prism. This arrangement enhances the reliability of the semiconductor device.
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