| 摘要 |
PURPOSE:To efficiently release heat through a path between a lead and a heat releasing fin by permitting the external lead of a surface mounting semiconductor device to be soldered on both wiring on a printed board and on the heat releasing fin. CONSTITUTION:External leads 2 and 3 whose bending depths are different are extended from the side planes of a mold package 1 which seals a power transistor inside. A semiconductor device is mounted on the opening of a printed board 4 and the external lead 2 is firmly adhered on wiring 4b by solder 6 and the external lead 3 on a heat releasing fin 6. |
