Electronic module assembly and method of forming same

摘要

A one-piece electronic module assembly is formed from a substantially rectangular baseplate on which an insulating film is mounted to carry circuit components. An enclosed assembly is completed by initially providing a pair of major bend axes across the baseplate, and forming inwardly extending notches at selected locations along lengthwise edges of the baseplate. The baseplate is bent at the notches to form a front wall, a pair of sidewalls and tabs that overlap the sidewalls. The baseplate is then bent over on itself along the major bend axes and sealed, if necessary, to form a completed assembly.