| 摘要 |
PURPOSE:To reduce the area and increase current capacity of a power supply wire of a semiconductor device to enhance the integration density. CONSTITUTION:A cell array 3 comprising a great mumber of unit cells is arranged inside a chip 1, power supplying cells 6, 7 for supplying power to the unit cells are arranged inside the cell array 3, and the power supplying cells 6, 7 are supplied with power from the external terminal through tapes 13, 15 for a TAB which are arranged between the chip 1 and a package containing the chip 1. |
