| 摘要 |
PURPOSE: To provide a semiconductor package and its manufacturing method in which each inner lead of a frame is fixed to each pad of a semiconductor chip by soldering, the thickness of the semiconductor chip is made thin, and a manufacturing process is simplified. CONSTITUTION: A solder 14 is formed on each pad of a semiconductor chip 11, each inner lead 15 of a frame is soldered by the solder 14, the semiconductor chip 11 and the inner lead 15 are connected electrically, thus manufacturing a semiconductor package. |
