| 摘要 |
<p>PURPOSE:To provide the title package wherein it can comply with the request for the small size of a package and for the large scale of an integrated circuit by further narrowing the interval between lead pins and it can surely prevent a defect such as a short circuit or the like when it is mounted on a board. CONSTITUTION:A semiconductor package uses lead pins at a lead frame as terminals for external extraction use at individual electrodes for a semiconductor chip. In the semiconductor package, the lead pins are constituted of metal interconnections 12 which have been formed on the surface of rectangular flat- boardlike lead fin parts 10c connected to the circumference of a bed part 10a at the lead frame 10 while insulators 11 are laid between them and said lead fin parts 10c.</p> |
