| 摘要 |
PURPOSE:To restrain a control electronic component from being deteriorated when an intelligent power module in which a semiconductor element for power use and the control electronic component have been mounted on the same board is assembled. CONSTITUTION:When a semiconductor element 5 for power use and control electronic components 6a to 6c are soldered, fixed and bonded to a metal-foil layer 4 on a metal-based board 1, a case 8 is soldered, fixed and bonded simultaneously to the peripheral edge of the metal-based board 1.
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