RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE,申请号JP19910300159-传众专利搜索

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发明名称	RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要
申请公布号	JPH05136190(A)	申请公布日期	1993.06.01
申请号	JP19910300159	申请日期	1991.11.15
申请人	TOSHIBA CORP	发明人	KOMUDA NAOYUKI
分类号	H01L21/56;H01L21/60;H01L23/28;H01L23/29;H01L23/31	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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