STRUTTURA DI DISPOSITIVO A SEMICONDUTTORE CON DISSIPATORE METALLICO E CORPO IN PLASTICA, CON MEZZI PER UNA CONNESSIONE ELETTRICA AL DISSIPATORE DI ALTA AFFIDABILITA'

摘要

A structure is disclosed which comprises a metal plate (12), a semiconductor material chip (13) attached to the plate (12), terminal rheophores (11), interconnection wires (18) between the rheophores (11) and metallized regions (17) of the chip (13), and a plastics body (10) which encapsulates the whole with the exception of a surface of the plate (12) and part of the rheophores (11). This structure has highly reliable means (19,21,23) of electrical connection between at least one metallized region (22) and the metal plate (12) which comprise at least one metal rod (19) resting onto the plate (12) and being attached thereto by studs (21) integral with the plate (12), and at least one wire (23) welded between a metallized region (22) of the chip (13) and the metal rod (19) between the studs (21). At least a portion of the rod (19) and its connection wire (23) are encapsulated within the plastics body (10).