首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
ANTIVIRALES THERAPEUTIKUM.
摘要
申请公布号
DE3784080(T2)
申请公布日期
1993.05.27
申请号
DE19873784080T
申请日期
1987.12.19
申请人
AO-FORSCHUNGSINSTITUT DAVOS, DAVOS-PLATZ, CH
发明人
TEPIC, SLOBODAN, CH-7270 DAVOS, CH
分类号
G01N33/544;A61K9/127;A61K9/133;A61K9/50;A61K38/00;A61P31/12;A61P31/18;G01N33/569;(IPC1-7):A61K9/50
主分类号
G01N33/544
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHOD AND APPARATUS FOR USER EQUIPMENT DIRECTED RADIO RESOURCE CONTROL IN A UMTS NETWORK
Location Based Contact Routing
SCENARIO GENERATION DEVICE AND SCENARIO GENERATION METHOD
Location Based Notification
BEAMFORMING BY SECTOR SWEEPING
Transceiver with Asymmetric Matching Network
CROSS-POLAR INTERFERENCE CANCELLATION SYSTEM, WIRELESS STATION DEVICE, WIRELESS COMMUNICATION METHOD
ELECTRICAL INTERCONNECT DEVICE
ELECTRICAL CONNECTOR HAVING TERMINAL PORTIONS IN SPECIFIC ARRANGEMENT AND A GROUNDING PLATE FOR EXCELLENT HIGH-FREQUENCY CHARACTERISTICS
Vehicle To Snow/Ice Control Device Wiring Harness With Replaceable Connector
Etchant and Etching Process
INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
ELECTRONIC COMPONENT, A SEMICONDUCTOR WAFER AND A METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A CAPPING LAYER
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STRUCTURES FOR THROUGH-SILICON VIAS, AND ASSOCIATED SYSTEMS AND METHODS
Method of Forming Wafer-Level Molded Structure for Package Assembly
METHODS OF GROWING HETEROEPITAXIAL SINGLE CRYSTAL OR LARGE GRAINED SEMICONDUCTOR FILMS ON GLASS SUBSTRATES AND DEVICES THEREON
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
Methods for Obtaining Positive Transformants of a Filamentous Fungal Host Cell