发明名称 METHOD OF MOLDING A THERMOPLASTIC RING ONTO A LEADFRAME
摘要 In a pre-molded package assembly, a thermoplastic ring molded onto a leadframe must maintain lead coplanarity. In this invention a plastic member of liquid crystal polmar is molded onto the leads of a metal leadframe. The plastic member is a thermoplastic anisotropic material which, when formed, has a flow direction which is in the long dimension of the plastic member and a transverse direction which is in the short dimension of the plastic member. Dam members on the leadframe help contain the plastic molding compound within the mold cavity during the molding process. A puddle gate prevents the formation of a weld line in the plastic member. Upon completion of the molding process, the dam members are excised from the leadframe to provide discrete leads. <IMAGE> <IMAGE>
申请公布号 US5213748(A) 申请公布日期 1993.05.25
申请号 US19910722069 申请日期 1991.06.27
申请人 AT&T BELL LABORATORIES 发明人 BISWAS, RANJIT;ZIMMERMAN, MICHAEL A.
分类号 B29C45/14;B29L31/34;H01L21/56;H01L23/057;H01L23/495;H01L23/50 主分类号 B29C45/14
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