发明名称 PLATING METHOD FOR CERAMIC PACKAGE
摘要 <p>PURPOSE:To provide a method for plating a ceramic package in which lead pins can be simply effectively plated and an operation after plating is facilitated. CONSTITUTION:Metal parts of a ceramic package are plated using a jig 13 having a base plate 10 or frame provided with many metal pipes 11 fixedly laid in parallel. Pins 3 of the package are inserted between pipes 11 of the jig to allow electroplating current to flow through the pins.</p>
申请公布号 JPH05129498(A) 申请公布日期 1993.05.25
申请号 JP19910314087 申请日期 1991.10.31
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KOBAYASHI MASARU
分类号 C25D7/00;H01L23/50 主分类号 C25D7/00
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