摘要 |
<p>PURPOSE:To provide a method for plating a ceramic package in which lead pins can be simply effectively plated and an operation after plating is facilitated. CONSTITUTION:Metal parts of a ceramic package are plated using a jig 13 having a base plate 10 or frame provided with many metal pipes 11 fixedly laid in parallel. Pins 3 of the package are inserted between pipes 11 of the jig to allow electroplating current to flow through the pins.</p> |